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UL /IEC/ EN 60950 Test Probe Kits BND-TPK01

Product Description:UL /IEC/ EN 60950 IEC61032 Test Probe KitsModel:BND-TPK01Product Details:The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:· IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)· 50mm Impact Test Ball (BND-G500R)
Description

Product Description:

UL /IEC/ EN 60950 IEC61032 Test Probe Kits

Model:BND-TPK01


Product Details:

The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:

· IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)

· 50mm Impact Test Ball (BND-G500R)

· Test Pin Probe: short (BND-13)

· Rigid Finger Probe (BND-11)

· Ball Pressure Tester (BND-QY102)

· Telecom Test Probe (BND-TB12)

Meets Requirements for Testing Standard(s) including but not limited to:IEC 60950EN 60950UL 60950CSA 950


Datasheets of BND-TPK01 test probe kit:


test probe B 1.jpgIEC61032  IEC60950  IEC60335
IEC60529  IEC60045  IEC60884
IEC60745
Knurled Finger Diameter:12mm
Knurled Finger Length:80mm
Baffle Plate Diameter:50mm
Baffle Plate Length:100mm
Baffle Thickness:20mm
BND-G500R
Test Sphere 500G with ring
 2.jpgIEC61032  IEC60529Diameter:50mm
Weight:227g
BND-13
Short Test Pin
 3.jpgIEC60065
IEC60335
IEC61032
The probe Diameter:Head 3mm Tail 4mm
The probe Length:15mm
Dam-board Diameter:25mm
Dam-board Thickness:4mm
BND-11
Rigid Test Probe 11
 4.jpgIEC61032
IEC60065
IEC60335
IEC60884
Nodular Finger Length:80mm
Nodular Finger Diameter:12mm
Dam-board Diameter:50mm
Dan-board Thickness:5mm
BND-TB12
12mm Telecom Test Probe
 5.jpgIEC60065 IEC60695 IEC60950Probe Diameter:12mm
Probe Length:80mm
Baffle Plate Diameter:50mm
BND-QY102
Ball Pressure Apparatus
 6.jpgIEC60695-10-2 IEC60884
IEC60320 IEC60335
IEC60598
IEC60950
Ball diameter:5MM
Total test pressure:20N±0.2N
Samples bearing Diameter:50mm,Length:100mm Solid stainless steel cylinder



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